Acronym |
Full Name |
CEIM |
Medium conductivity from EID processing |
UU |
Volumetric Photoelectric Factor, Up |
HMIN |
HIP Micro Inverse Resistivity |
QP11 |
Acoustic pick quality curve |
AF10 |
Array Induction Four Foot Resistivity A10 |
SCO3 |
Smoothed Worst Bin Standoff Correction |
PEFL |
Long-Spaced Corrected Photoelectric Factor |
SSVE |
Sonic Shear Velocity |
TTCO_RT |
Transit Time for Compressional, Real-Time |
ASCA |
Array Induction SPA Calibrated |
SFDF |
Smoothed Far Detector ONLY Porosity (Dolomite Matrix-Fixed Hole Size) |
E2RC |
Channel 2 (imag) echo amplitudes scaled by calib. factor |
HRHO |
High Resolution Bulk Density |
AHTCO10 |
Array Induction Two Foot Conductivity A10 |
HDPO |
High Resolution Density Porosity |
A4TN |
Attenuation derived from P4HS and R4AT |
AFD2 |
Array Induction Four Foot Outer Diameter of Invasion (D2) |
HSIG |
APS High Resolution Formation Capture Cross Section |
LTT4 |
Long Spacing Transit Time 4 |
RACVH |
Resistivity Attenuation Compensated Borehole and Inversion Corrected Long 2MHz |
HPEF |
High Resolution Photoelectric Factor |
TRDST01 |
Dipole multiplex waveform start time |
TNRL |
Thermal Neutron Ratio, Left |
MCBW |
MRIL clay bound porosity (3 bins of TP) |
MXSL |
Maximum Labeling Slowness, Compressional |